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Anisotropic conductive film ACF

Anisotropic conductive film (ACF) is a special coating material that has the functions of unidirectional conductivity and adhesive fixation. This type of film has a protective film on both the top and bottom to protect the main components. When using, first remove the cover film, attach the anisotropic conductive adhesive film to the electrode of the substrate, and then remove the other layer of PET base film as well. After precise alignment, press the upper object onto the lower plate, heat and apply pressure for a period of time to solidify the insulating adhesive material, and finally form a stable structure with vertical conductivity and horizontal insulation.

Image sensor camera specific conductive adhesive

2024-05-29

Model: CP Series Product Features: ACF for solderless connections connects components with fine pitch circuits (such as image sensors) to substrates with low-temperature thermal compression bonding instead of solder. Width 2MM-30MM customizable project unit CP series application - solderless connection film with minimum contact area μ m2 30000 minimum space μ m 100 overlap conditions temperature ° C 120~time seconds 10~pressure MPa 1~Compared with standard solder electroplating methods, it is only packaged by pasting and hot pressing bonding, and the number of processes is greatly reduced, used for fine pitch circuit connections.

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Film On Plastics (ACF)CP923CM-25AC

2024-05-29

Model: CP923CM-25AC/CP923AM-18AC Product Features: Can be connected with thin electrodes and fine pitch. Excellent adhesion to plastic materials. Adopting thermosetting resin of acrylic acid. It has excellent repairability and can be pressed at low temperatures for a short period of time. Suitable for thin film materials that are easily affected by heat.

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Glass Touch Panel Glass and Film Material (ACF) CP806AM-16AC

2024-05-29

Model: CP806AM-16AC Product Features: Suitable for electrode connection between glass substrate and thin film material of touch panel. Specially developed thermosetting resin components have excellent adhesion and are suitable for 2-layer and 3-layer FPCs.

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Film On Board/Film(ACF)CP801AM-35AC

2024-05-29

Model: CP801AM-35AC Product Features: By switching from connector connection to ACF connection, the product achieves thinning and fine pitch, and contributes to the thinning and miniaturization of components and other parts.

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FPD's Film On Glass (ACF) CP133 series

2024-05-29

型號：CP133系列 產(chǎn)品特性：經(jīng)專門研發(fā)的熱固性樹脂成分具有優(yōu)異粘合性,適用于2層、3層的FPC。通過使用我公司自主開發(fā)的絕緣層的粒子，使產(chǎn)品擁有優(yōu)異的傳導(dǎo)特性以及端子間絕緣特性，并能夠?qū)嵭屑?xì)間距（Fine pitch）連接。   型號 CP133系列 PAF700系列 型 FOG FOG/FOP 可對應(yīng)被貼材料 TCP/COF/FPC COF 玻璃基板 玻璃基板/柔性電路板 可對應(yīng)最小電極間距[μm]※1 25 5 可對應(yīng)最小接觸面積[μm2]?※2 12,000 1,000～1,500 厚度[μm] 18, 25 10 導(dǎo)電粒子 種類 鍍鎳樹脂粒子 鍍鎳樹脂粒子 粒子直徑[μm…

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CHIP ON GLASS with anisotropic conductive film (ACF) PAF400 series

2024-02-27

通過把導(dǎo)電粒子整列在預(yù)想位置的“粒子整列技術(shù)”、以及抑制接合時(shí)導(dǎo)電粒子流動(dòng)的“粒子固定化技術(shù)”，以少量粒子實(shí)現(xiàn)穩(wěn)定的粒子捕捉性能。通過減少導(dǎo)電粒子，并進(jìn)行固定化降低細(xì)間距連接時(shí)發(fā)生短路的風(fēng)險(xiǎn)。在IC和面板連接中，實(shí)現(xiàn)最小連接面積720μm2、可對應(yīng)最小間距8μm。   型號 PAF400系列 工藝 COG/GOP 可對應(yīng)被貼材料 IC OLED 玻璃基板/柔性電路板 可對應(yīng)最小電極間距[μm]※1 8 可對應(yīng)最小接觸面積[μm2]※2 720 厚度[μm] 10 導(dǎo)電粒子 種類 鍍鎳樹脂粒子 粒子直徑[μmФ] 3.0 鍍上絕緣層粒子 ○ 本壓著條件 溫度[℃] 190～230 時(shí)間…

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適用于中小型FPD的Chip On Glass用異方性導(dǎo)電膜(ACF)PAF300系列

2024-02-27

通過把導(dǎo)電粒子整列在預(yù)想位置的“粒子整列技術(shù)”、以及抑制接合時(shí)導(dǎo)電粒子流動(dòng)的“粒子固定化技術(shù)”，以少量粒子實(shí)現(xiàn)穩(wěn)定的粒子捕捉性能。通過減少導(dǎo)電粒子，并進(jìn)行固定化降低細(xì)間距連接時(shí)發(fā)生短路的風(fēng)險(xiǎn)。在IC和面板連接中，實(shí)現(xiàn)最小連接面積400μm2、可對應(yīng)最小間距5μm。可對應(yīng)產(chǎn)品寬度1.0mm   型號 PAF300系列 工藝 COG 可對應(yīng)被貼材料 IC LCD 玻璃基板 可對應(yīng)最小電極間距[μm]※1 5 可對應(yīng)最小接觸面積[μm2]※2 400 厚度[μm] 16 導(dǎo)電粒子 種類 鍍鎳樹脂粒子 粒子直徑[μmФ] 3.2 鍍上絕緣層粒子 ○ 本壓著條件 溫度[℃] 130～160 時(shí)…

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